by Karl Freund | May 7, 2025 | In the News
Most chips today are built from a combination of customized logic blocks that deliver some special sauce, and off-the-shelf blocks for commonplace technologies such as I/O, memory controllers, etc. But there is one needed function that has been missing; an AI...
by Karl Freund | Apr 29, 2025 | In the News
The US Semiconductor industry desperately needs to rebuild the country’s ability to produce the advanced chips that are the cornerstone of AI and every electronic device you can imagine. Most of those chips are built today in Taiwan by TSMC. Merely the thought of any...
by Karl Freund | Dec 9, 2024 | In the News
The idea of chiplets is simple: develop the best semiconductors for the needed functions using the most proper manufacturing process. Then combine an assortment of chiplets on a multi-die package, and voila! A lower-cost approach to advanced semiconductors. The...
by Karl Freund | Apr 17, 2024 | In the News
Cadence has updated its platforms that supports chip design teams, offering more than 2X more capacity and 1.5X faster performance than the previous generation and can support chips up to 48 billion gates. Designing and testing chips is constantly becoming more...
by Karl Freund | Apr 11, 2024 | In the News
Instead of having to choose to run on-prem or in the cloud, with attendant upload times and costs, the new True Hybrid offering from Cadence creates a dynamic environment for chip and system design. When creating a new chip, design teams currently have to chose...
